3D model (JSmol)
CompTox Dashboard (EPA)
|Molar mass||194.955 g/mol|
|Melting point||3,090 °C (5,590 °F; 3,360 K)|
|P-62m, No. 189|
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
|(what is ?)|
As a thin film TaN find use as a diffusion barrier and insulating layer between copper interconnects in the back end of line of computer chips. Tantalum nitrides are also used in thin film resistors.
The tantalum - nitrogen system includes several states including a nitrogen solid solution in Tantalum, as well as several nitride phases, which can vary from expected stoichiometry due to lattice vacancies. Annealing of nitrogen rich "TaN" can result in conversion to a two phase mixture of TaN and Ta5N6.
Ta5N6 is thought to be the more thermally stable compound - though it decomposes in vacuum at 2500C to Ta2N. It was reported the decomposition in vacuum from Ta3N5 via Ta4N5, Ta5N6, ε-TaN, to Ta2N.
TaN is often prepared as thin films. Methods of depositing the films include RF-magnetron-reactive sputtering, Direct current (DC) sputtering, Self-propagating high-temperature synthesis (SHS) via 'combustion' of Tantalum powder in Nitrogen, low‐pressure metalorganic chemical vapor deposition (LP‐MOCVD), ion beam assisted deposition (IBAD), and by electron beam evaporation of tantalum in concert with high energy nitrogen ions.
Depending on the relative amount of N2, the deposited film can vary from (fcc) TaN to (hexagonal) Ta2N as nitrogen decreases. A variety of other phases have also been reported from deposition including bcc and hexagonal TaN; hexagonal Ta5N6; tetragonal Ta4N5; orthorhombic Ta6N2.5, Ta4N, or Ta3N5. The electrical properties of TaN films vary from metallic conductor to insulator depending on the relative nitrogen ratio, with N rich films being more resistive.
It is sometimes used in integrated circuit manufacture to create a diffusion barrier or "glue" layers between copper, or other conductive metals. In the case of BEOL processing (at c. 20 nm), copper is first coated with tantalum, then with TaN using physical vapour deposition (PVD); this barrier coated copper is then coated with more copper by PVD, and infilled with electrolytically coated copper, before being mechanically processed (grind/polishing).