According to
a new market research report "Thin Wafer Market by
Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding,
Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF
Devices, LED, Interposer, Logic), and Region - Global Trend and Forecast to
2022", the thin wafer market was valued USD 6.76 Billion
in 2015 and estimated to reach USD 9.17 Billion by 2022, at a CAGR of 3.7%
between 2016 and 2022. Factors such as growth in the semiconductor industry,
reduction in the size of electronic devices, growing mobile and consumer
electronic markets, and high amount of material saving are key drivers for the
growth of the thin wafer market. Moreover, the growing IC industry in China and
high adoption of portable devices provide a huge opportunity for further growth
of this market.
300mm wafer
expected to lead the thin wafer market:
The 300mm wafer is widely used in
the manufacturing of semiconductor devices due to its high production capacity
among all other wafers. This wafer size is expected to exhibit highest growth
during the forecast period. It offers the ability to manufacture a large number
of devices in a single batch. This is one of the reasons companies are
developing their semiconductor devices on this wafer.
Get PDF Brochure: https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=255706993
Target Audience:
- Raw Material Suppliers
- Silicon Wafer Providers
- System Integrators
- Middleware and Firmware Providers
- Semiconductor Device Manufacturers
- Suppliers and Distributors
- Government and Other Regulatory Bodies
- Research Institutes and Organizations
- Market Research and Consulting Firms
This report provides valuable insights regarding the ecosystem of this
thin wafer market, such as product manufacturers and suppliers, OEMs, system
integrators, suppliers and distributors, electronic device manufacturers, and
semiconductor device manufacturers. This study answers several questions for
stakeholders, primarily which focus on prioritizing efforts and investments in
this market, in the next two to six years.
Key players operating in this thin wafer market are LG Siltronic, Inc.
(South Korea), Shin-Etsu Chemical Co., (Japan), Siltronic AG (Germany), SUMCO
Corporation (Japan), SunEdision Semiconductor Ltd. (U.S.), SUSS MicroTec AG
(Germany), Lintec Corporation (Japan), DISCO Corporation (Japan), 3M (U.S.),
Applied Materials, Inc. (U.S.), Nissan Chemical Corporation (Japan), Synova
(Switzerland), EV Group (U.S.), Brewer Science, Inc. (U.S.), and Ulvac GmbH
(Germany).
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