According to the forecast
provided by MarketsandMarkets, the overall hermetic packaging market
is estimated at USD 3.25 Billion in 2018 and is expected to reach USD 4.52
Billion by 2023, growing at a CAGR of 6.80% between 2018 and 2023. The key
factors driving this market is growing need of protecting highly sensitive
electronic components from extraneous particles, such as moisture, atmospheric
pressure, and soil/grime; and strong demand for hermetically packaged
components from the industries such as automotive, electronics, and
aeronautics.
This report segments the hermetic
packaging market on the basis of configuration, type, application, industry,
and geography. The market, on the basis of configuration, is driven by high
adoption rate of the multilayer ceramic packages for high frequency
applications such as data communication, wireless communication, and optical
communication, as multilayer ceramic packages offer better hermeticity than
other configurations for high-frequency applications, and also enable a large
number of electrical feedthroughs within small spaces.
The hermetic market for
ceramic-metal (CERTM) sealing is expected to hold a major share and grow at the
highest CAGR between 2018 and 2023. Growing demand for thermal shock-resistant
and low-porosity type of hermetic packaging material is the key factor that
propels the growth of the said market. The CERTM sealed sensors, such as
heating-ventilation-air conditioning (HVAC) sensors, chassis level sensors, and
differential non-contacting sensors, are finding potential applications in the
automotive industry as they assure the safety of the passengers while offering
failure-free operation.
Based on application, the market
for transistors is expected to hold a major share during the forecast period.
The hermetically sealed transistors are mainly used for designing telecommunication
circuits and home appliances. This is a key driving factor for the said market.
However, the market for microelectromechanical system (MEMS) switches is
expected to grow at the highest rate during the forecast period.
The market in APAC is expected to
hold the largest market share and also projected to grow at the highest CAGR
between 2018 and 2022. Increasing energy needs (backed by the high GDP growth
rates) in developing countries, such as China and India, is creating huge
opportunities for manufacturers of hermetically packaged electronic components
in APAC. China, Japan, and India, among others, are now stepping up in space
research activities, such as satellite launches and space exploration missions,
which is expected to add to the high growth of the hermetic packaging market in
APAC during the forecast period.
https://www.marketsandmarkets.com/PressReleases/hermetic-packaging.asp
The major challenges for the
companies in the market are the high infrastructure cost incurred by controlled
and regulated packaging environment and competition from near-hermetic
packaging. SCHOTT AG (Germany), AMETEK (US), Amkor Technology (US), Texas
Instruments (US), Teledyne Microelectronics (US), Kyocera Corporation (Japan),
Materion Corporation (Japan), Egide (France), Micross Components (US), Legacy
Technologies Inc. (US) are the major players that adopt various strategies such
as new product developments; mergers and acquisitions; partnerships,
agreements, and collaborations to cater to the needs of customers.
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