[130 Pages Report] The high density interconnect market is expected to grow from USD 9.5
billion in 2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to
2023. A few key factors driving the growth of this market are increasing
adoption of advanced electronics and safety measures in the automotive vertical
and growing demand for smart consumer electronics and wearable devices.
“The HDI market for 10+
Layers HDI to grow at the highest CAGR during the forecast period”
The HDI market for 10+ Layers HDI is expected to grow at the
highest CAGR during the forecast period. This growth can be attributed to 10+
Layers HDIs being used in a wide range of devices, such as high-reliability
automotive products, high-density mobile devices, and IoT modules. 10+ layers
HDI offer benefits such as small size, lightweight construction, and enhanced
flexibility.
“The HDI market for
wearable electronics to grow at the highest CAGR during the forecast period”
The HDI market for wearable devices is expected to grow at
the highest CAGR during the forecast period. HDI PCBs possess technical
characteristics of extremely high density routing interconnections and make the
high density of components possible. These attributes contribute to the high
performance and lightweight of HDI boards that make them ideal for powering wearable
devices.
“APAC is expected to
account for the largest market share during the forecast period”
APAC will likely account for the major share of the global
HDI market in during the forecast period. This growth can be attributed to the
increasing application of HDI in consumer electronics, automotive, and
healthcare verticals in countries such as China, India, and South Korea. It is
also due to the extension of telecommunications networks in China, Thailand,
Malaysia, South Korea, India, and other developing countries in APAC.
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Key Market Players
Major players in the HDI market include Unimicron (Taiwan),
Compeq Co. (Taiwan), TTM Technologies (US), Austria Technologie &
Systemtechnik (Austria), Zhen Ding Tech. (Taiwan), IBIDEN (Japan), MEIKO
ELECTRONICS Co. (Japan), FUJITSU INTERCONNECT TECHNOLOGIES (Japan), Tripod
Technology Corp. (Taiwan), Unitech (Taiwan), SAMSUNG ELECTRO-MECHANICS (South
Korea), Daeduck GDS Co (South Korea), DAP Corp. (South Korea), Korea Circuit
(South Korea), CMK (Japan), NCAB Group (Sweden), SIERRA CIRCUITS (US), and
Multek (Hong Kong).
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