The
high
density interconnect market is expected to grow from USD 9.5 billion in
2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to 2023. A few
key factors driving the growth of this market are growing demand for smart
consumer electronics and wearable devices and increasing adoption of advanced
electronics and safety measures in the automotive vertical.
HDI
PCBs capitalize on the latest technologies available to increase the
functionality of PCBs using the same or less amount of area. HDI PCBs possess
technical characteristics of extremely high density routing interconnections
that make the high density of components possible. HDI PCBs are a perfect
solution for shrinking the footprint of electronics technology, comprising the
core components of consumer electronic devices such as laptop computers,
tablets, smartphones, and even wearable technology such as fitness bands and
virtual reality devices.
The
HDI market for 10+ Layers HDI is expected to grow at the highest CAGR during
the forecast period. This growth can be attributed to 10+ Layers HDIs being
used in a wide range of devices, such as high-reliability automotive products,
high-density mobile devices, and IoT modules. 10+ layers HDI offer benefits
such as small size, lightweight construction, and enhanced flexibility.
The
HDI market for the medical end-user segment is expected to grow at the highest
CAGR during the forecast period. The range of HDI PCB applications in the
medical industry is vast and ever-growing. HDI PCBs can be found in pacemakers,
defibrillators and heart monitors, medical imaging systems, MRIs, CT scans, and
ultrasonic equipment among others. HDI PCBs are also used in medical devices
like body temperature monitors, blood glucose monitors, and electrical muscle
stimulation equipment.
The
market for wearable devices is expected to grow at the highest CAGR during the
forecast period. HDI PCBs possess technical characteristics of extremely
high-density routing interconnections and make the high density of components
possible. These attributes contribute to the high-performance and lightweight
of HDI boards that make them ideal for powering wearable devices.
The
HDI market in APAC is expected to grow at the highest CAGR during the forecast
period. This growth can be attributed to the increasing application of HDI in
consumer electronics, automotive, and healthcare verticals in countries such as
China, India, and South Korea. It is also due to the extension of
telecommunications networks in China, Thailand, Malaysia, South Korea, India,
and other developing countries in APAC.
https://www.marketsandmarkets.com/PressReleases/high-density-interconnect.asp
Opportunities
for the growth of the market include rising demand for connected devices and
the evolution of 5G technology. Many of the connected devices require PCBs that
are small enough to fit into constricted spaces without compromising on
performance. HDI PCB technology can ensure that the circuit boards powering IoT
devices are sufficiently small and high-performance. HDI is rapidly emerging as
a promising technology for designing advanced 5G devices since HDI PCBs support
high-density attributes, and they allow buried routing within multi-layered
highly-interconnected structures.
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