COVID-19 Outbreak to
Decelerate Demand for Chemical Mechanical Planarization (CMP) Slurries in
Short-Term, Advanced Technologies to Re-Ignite Growth through 2030, Concludes
Fact.MR
CMP Slurry market
is poised to witness two fold growth by the end of 2029, driven by its
expanding applications in consumer electronics. Efficacy to offer exceptional
planarization and minimal surface defectivity makes CMP slurries an ideal
ingredient in CMP (chemical mechanical polishing).
CMP slurries will continue their legacy with the emerging
need for new abrasives combined with advanced additives to maintain a steady
growth trajectory. This in turn will propel the CMP slurry market to grow at an
astounding CAGR of ~8% during the forecast period (2019-2029).
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Key Takeaways of CMP
Slurry Market:
Technological advances in semiconductor processing and
fabrication has led to the requirement for highly polished and abrasion free
components which will create a progressive environment for growth of the
market.
Advanced device architectures and technologies like 3D
FinFETs, 3D NANDs and 3D packaging will surge the demand for CMP slurries
during the assessment period.
Based on product, aluminum oxide is projected to surpass
market valuation over US $ 1470 Mn by the end of 2029
Cerium oxide is projected to register dominating growth rate
among other products and is anticipated to gain 147 BPS by the end of 2029
Silicon wafers are projected to remain a highly lucrative
application in forthcoming years, representing over half of the global revenue
share till 2029.
Advanced technologies and multilayers are set to offer
additional opportunities as well as new challenges in the market.
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In terms of revenue, Asia Pacific excluding Japan (APEJ)
will continue to dominate the global CMP slurry market throughout the forecast
period with a CAGR of ~8%
“Increasing necessity of tunable slurries with lower
defectivity and high oxide removal rate will augment the demand for CMP
slurries”, says the Fact.MR analyst.
Contact Information
Fact.MR
US Sales Office:
11140 Rockville Pike, Suite 400 Rockville, MD
20852
United States
Phone: +1 (628) 251-1583
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More: https://www.prnob.com/release/show/chemical-mechanical-planarization-cmp/44563
