The 3D IC and 2.5D IC Market is
expected to be worth USD 170.46 Billion by 2022, at a CAGR of 38.30% between
2016 and 2022. The growth of this market is mainly driven by the increasing
need for advanced architecture in electronics products, trend of
miniaturization of electronic devices, and growing market for tablets,
smartphones, and gaming devices.
3D wafer-level chip-scale packaging (WLCSP) market held the largest
size in 2015
3D WLCSP is
one of the most compact package types with increased functionality and improved
thermal performance in printed circuit boards compared to 3D TSV and 2.5D IC.
3D WLCSP has a simplified process design for the manufacturing of 3D ICs, which
uses polymers that can sustain high temperatures, thus addressing the thermal
issue which is the major challenge for this market. WLCSP has gained popularity
in space-constrained mobile applications and other portable consumer devices as
well as industrial products as it offers a cost-effective, small, lightweight,
high-performance semiconductor solution.
Market for memory expected to grow at the highest rate during the
forecast period
The use of
3D ICs is expected to provide a cost-effective solution and drive the
wide-scale adoption of this technology in potential end products. The average
number of stacked dies in DRAM modules is expected to grow with an increase in
the demand for notebook computers. Moreover, the innovations in advanced data
storage such as flash memory, hybrid memory cube, and so on create a demand for
3D IC and 2.5D IC technology to obtain high-performing compact memory
solutions.
APAC held the largest share of the 3D IC and 2.5D IC Market in
2015
The major
factors driving the APAC market are the presence of major semiconductor
foundries including TSMC (Taiwan) and UMC (Taiwan), proximity to major
downstream electronics manufacturing operations, government-sponsored
infrastructure support, tax incentives, and availability of skilled engineers
and labor at a relatively low cost.
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